# Specifications

***Copyright © Quectel Wireless Solutions Co., Ltd. 2026. All rights reserved.***

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# Specification parameters

| **Quectel Pi H1** | **Description** |
| --- | --- |
| Package | PCBA |
| Dimensions (**mm**) | (108 +0.10/-0.15) × (68.70 +0.10/-0.15) × (20.77 +0.10/-0.15) |
| Weight (**g**) | 68 ±0.5 |

# Key parameters

| **Category** | **Description** |
| --- | --- |
| Application processor | High-performance **64-bit** octa-core processor, delivering up to **12 TOPS** of computing power **1 × A78 @ 2.7 GHz + 3 × A78 @ 2.4 GHz + 4 × A55 @ 1.9 GHz32 KB L1I** cache, **32KB L1D** cache and **512 KB L2** cache |
| GPU | **Adreno™ 643L** @ **812 MHz** |
| Memory | 8 GB LPDDR4X + 128 GB UFS |
| Operating system | **Yocto Linux (Kernel 5.15)*** / **Debian 13*** |
| Weight (g) | Approximately 67.6 |
| **USB** interfaces | **1 × USB 3.1 Type-C** , compatible with **USB 2.0**. with up to **5 Gbps** data rate **2 ×** standard **USB 2.0 Type-A** , supporting host mode only,and with up to **480 Mbps** data rate **1 × USB Type-C** for main power supply |
| Display interfaces | **1 × USB Type-C** (**DP over USB Type-C**), **DisplayPort 1.4**, with up to **4K** (**3840 × 2160**) **@ 60 fps1 × Micro HDMI** ①, **Micro HDMI 2.0 (Frame rate to be determined\*)**. decoding: **4K (H.264/ H.265/ VP9) @ 30 fps1 × FPC connector** ①, **4-lane MIPI DSI D-PHY 1.2, 1280 × 800 @ 60 fps** |
| Audio interfaces | **1 x 3.5 mm** CTIA/AHJ (U.S.) & OMTP (China) combo audio jack **1 × micro HDMI** for audio output***1 ×** on-board **DMIC1** × speaker |
| Camera interfaces | **2 × FPC** connectors, **4-lane MIPI CSI**, with up to **2.5 Gbps/ lane** data rate |
| Ethernet interface | **1 ×** standard **RJ45** , supports **10/100/1000 Mbps** Ethernet |
| **PCIe** interface | **1 × FPC** connector, **1-lane PCIe 3.0**. with up to **8 GT/s ×1 lane** data rate |
| **SD** card interface ② | **1 × SD 3.0**, **4-bit SDIO** |
| **UART** interface | **1 × DBG_UART** ,only for debugging |
| **ADC** interfaces | **3 × ADC** header pins (max. input voltage: **1.8 V**) |
| Expansion interfaces | **6 × I2Cs** (multiplexed with other interfaces)**1 × I2S** (multiplexed with other interfaces)**4 × SPIs** (multiplexed with other interfaces)**4 × UARTs** (multiplexed with other interfaces)**3 × PWMs** (multiplexed with other interfaces)**28 × GPIOs** (multiplexed with other interfaces)**1 × SDIO** ② (switchable) |
| Key interfaces | **1 × PWRKEY**,for turn-on/ turn-off; internally pulled up **1 × KEY1**, user-definable function button **1 × KEY2**, user-definable function button **1 × USB_BOOT**, a function button that forces the product into download mode |
| **LED** indicators | Red, blue and green |
| Antenna interfaces | **1 × Wi-Fi** / Bluetooth antenna connector1 × RF coaxial connector (**ECT818000500**), compatible with **ECT818003008** RF coaxial cable③ |
| WLAN | **2.4 GHz & 5 GHzIEEE 802.11a/b/g/n/ac** |
| Bluetooth | 5.0④ |
| Temperature ranges | Operating temperature: **-20 °C ~ +70 °C** Storage temperature: **-40 °C ~ +85 °C** |
| Power supply requirements | USB Type-C power input, which must be a PD-compatible adapter capable of 9V/3A or 5V/5A output |
| Shielding cover | N/A |
| Firmware upgrade | **USB0OTA*** |
| RoHS | All components are fully compliant with the EU RoHS Directive 2011/65/EU |

**Notes:**

*：Under development.

①：The Micro HDMI interface and MIPI display interface are mutually exclusive and cannot be used simultaneously.

②：The SD card functionality is switch-selectable between an on-board card slot and a 2 × 20-pin SDIO header, which are mutually exclusive and cannot be used simultaneously.

③：The product offers two configurable antenna solutions. For details, please contact Quectel Technical Support.

④：The product is fully compliant with all mandatory Bluetooth 5.0 features but does not implement optional features such as the 2 Mbps BLE PHY or Advertising Extensions.

# Functional block diagram

```{image} images/image_T1OZbvqxKojD5gxDb1VcF1rUnoy.webp
:width: 1438px
:height: 736px
```

# Interface description

## Detailed interface diagram

```{image} images/image_FLdlbSfujorhcHxT3lJcEoGWnhg.webp
:width: 1304px
:height: 399px
```

## Interface description table

| **No.** | **Interface name** | **Description** |
| --- | --- | --- |
| 1 | Micro HDMI | **Micro HDMI** video output interface, supports **4k @ 60 Hz** |
| 2 | Ethernet | Supports **10/100/1000 Mbps** Ethernet |
| 3 | Fan connector | **5V** fan power connector |
| 4 | USB Type-A | **2** standard **USB 2.0 Type-A** interfaces |
| 5, 6 | Camera interface | **2** channels of **4-lane MIPI CSI**, the maximum data rate is **2.5 Gbps/ lane** |
| 7 | DSI display interface | 1 channel of **4-lane MIPI DSI D-PHY 1.2, 1280 × 800 @ 60 fps**, the maximum data rate is **2.5 Gbps/lane** |
| 8 | UART | Debugs UART, for debugging only |
| 9 | ADC | 3 channels of ADC test interface pins, maximum input voltage 1.8 V |
| 10 | DMIC | Digital microphone |
| 11 | Speaker | Speaker output, 2-pin 1.25 mm pitch universal speaker connector |
| 12 | Headphone | **3.5 mm** audio interface, audio output |
| 13 | USB Type-C | Display interface: **USB Type-C** interface (DP Over USB Type-C), DisplayPort 1.4, maximum 4K (3840 × 2160) @ 60 fpsexpansion interface: **USB 3.1 Type-C** interface, compatible with **USB 2.0** |
| 14 | **USB Type-C** power supply | DC power input via **USB Type-C**; supports **PD** protocol |
| 15 | **PWRKEY** button | Power on/off button, need to long press this button to power on when the "auto power-on" function is not enabled |
| 16 | KEY1 | User-definable function |
| 17 | KEY2 | User-definable function |
| 18 | PCIe | **PCIe 3.0** interface for high-speed peripherals, the maximum data rate is **8 Gbps** |
| 19 | USB_BOOT | Forces the product to enter download mode |
| 20 | **2 × 20-pin** header | Multi-function GPIO header; multiplexed with I2C, SPI, PWM, etc. |
| 21 | **Wi-Fi**/Bluetooth **PCB** on-board antennaRF Coaxial connector | Wi-Fi/Bluetooth **PCB** on-board antenna or RF coaxial connector **ECT818000500** |
| 22 | **SD** card | Push-type SD card slot, compliant with SD 3.0 protocol |
| 23 | Auto power-on switch | Switch for "auto power-on" function when powered |

- **Two antenna options are available: Wi-Fi/Bluetooth PCB on-board antenna or RF coaxial connector. When the PCB on-board antenna is selected, the RF coaxial connector will not be soldered on the product.**

# 40-Pin connector definition

The following is the pin definition list for the **2 × 20-pin** connector:

| **Pin No.** | **Pin name** | **Pin No.** | **Pin name** |
| --- | --- | --- | --- |
| 1 | 3V3 | 2 | 5V |
| 3 | I2C0_SDA | 4 | 5V |
| 5 | I2C0_SCL | 6 | GND |
| 7 | GPIO_77 | 8 | UART_TXD |
| 9 | GND | 10 | UART_RXD |
| 11 | GPIO_16 | 12 | GPIO_101 |
| 13 | GPIO_17 | 14 | GND |
| 15 | GPIO_18 | 16 | GPIO_32 |
| 17 | 3V3 | 18 | GPIO_33 |
| 19 | SPI_MOSI | 20 | GND |
| 21 | SPI_MISO | 22 | GPIO_19 |
| 23 | SPI_CLK | 24 | SPI_CE0 |
| 25 | GND | 26 | SPI_CE1 |
| 27 | I2C1_SDA | 28 | I2C1_SCL |
| 29 | GPIO_49 | 30 | GND |
| 31 | GPIO_48 | 32 | GPIO_76 |
| 33 | GPIO_78 | 34 | GND |
| 35 | GPIO_103 | 36 | GPIO_34 |
| 37 | GPIO_35 | 38 | GPIO_104 |
| 39 | GND | 40 | GPIO_102 |

# Camera pin definition

The following is the pin definition list for the **Camera 1 22-pin** connector:

| **Pin No.** | **Pin name** | **Pin No.** | **Pin name** |
| --- | --- | --- | --- |
| 1 | GND | 2 | MIPI_CSI0_LN0N |
| 3 | MIPI_CSI0_LN0P | 4 | GND |
| 5 | MIPI_CSI0_LN1N | 6 | MIPI_CSI0_LN1P |
| 7 | GND | 8 | MIPI_CSI0_CLKN |
| 9 | MIPI_CSI0_CLKP | 10 | GND |
| 11 | MIPI_CSI0_LN2N | 12 | MIPI_CSI0_LN2P |
| 13 | GND | 14 | MIPI_CSI0_LN3N |
| 15 | MIPI_CSI0_LN3P | 16 | GND |
| 17 | CAM_GPIO20_L | 18 | GPIO133&MCLK_L |
| 19 | GND | 20 | CAM_I2C_SCL0_0 |
| 21 | CAM_I2C_SDA0_0 | 22 | VDD_3V3_CAM1 |

The following is the pin definition list for the **Camera 2 22-pin** connector:

| **Pin No.** | **Pin name** | **Pin No.** | **Pin name** |
| --- | --- | --- | --- |
| 1 | GND | 2 | MIPI_CSI1_LN0N |
| 3 | MIPI_CSI1_LN0P | 4 | GND |
| 5 | MIPI_CSI1_LN1N | 6 | MIPI_CSI1_LN1P |
| 7 | GND | 8 | MIPI_CSI1_CLKN |
| 9 | MIPI_CSI1_CLKP | 10 | GND |
| 11 | MIPI_CSI1_LN2N | 12 | MIPI_CSI1_LN2P |
| 13 | GND | 14 | MIPI_CSI1_LN3N |
| 15 | MIPI_CSI1_LN3P | 16 | GND |
| 17 | CAM_GPIO21_L | 18 | GPIO45&MCLK_L |
| 19 | GND | 20 | CAM_I2C_SCL1_0 |
| 21 | CAM_I2C_SDA1_0 | 22 | VDD_3V3_CAM2 |

# PCIe pin definition

The following is the pin definition list for the **PCIe 16-pin** connector:

| **Pin No.** | **Pin name** |
| --- | --- |
| 1 | PCIE1_RST_N |
| 2 | PCIE1_CLK_REQ_N |
| 3 | PCIE1_WAKE_N |
| 4 | PCIE1_PWR_EN |
| 5 | GND |
| 6 | PCIE1_TX0_M |
| 7 | PCIE1_TX0_P |
| 8 | GND |
| 9 | PCIE1_RX0_M |
| 10 | PCIE1_RX0_P |
| 11 | GND |
| 12 | PCIE1_REFCLK_M |
| 13 | PCIE1_REFCLK_P |
| 14 | GND |
| 15 | VCC_5V |
| 16 | VCC_5V |

# Mechanical dimensions

This section describes the mechanical dimensions of the product, all dimensions are in **mm**. For all dimensions without marked tolerances, the tolerance is **+0.10/-0.15**.

```{image} images/image_Fv5fbo0WWoIl1Sxqnn2ctjVCnRf.webp
:width: 895px
:height: 629px
```

 

```{image} images/image_ZC7UbizY1o9muKx5GhycXWr3njB.webp
:width: 893px
:height: 573px
```

# Electrical characteristics

## Absolute maximum ratings

| **Parameter** | **Minimum** | **Maximum** | **Unit** |
| --- | --- | --- | --- |
| **USB Type-C** supply voltage | -0.3 | 20 | V |
| Digital pin voltage of expansion interface | -0.3 | 3.6 | V |

> **Note**: Exceeding the operating conditions shown in the above table may cause permanent damage to the product.

## Power supply ratings

The product can be powered through the **POWER IN Type-C** port, supporting **USB PD 3.0** fast charging protocol. The power supply for the product should be able to provide **9 V/ 3 A** or **5 V/5 A** or higher power supply.

## Digital logic level characteristics

2 × 20-pin I/O requirements (Unit: V)

| **Parameter** | **Description** | **Minimum** | **Maximum** |
| --- | --- | --- | --- |
| **VIH** | Input high level | 2.81 | 3.3 |
| **VIL** | Input low level | 0 | 0.66 |
| **VOH** | Output high level | 3 | 3.3 |
| **VOL** | Output low level | 0 | 0.3 |

## ESD protection

Static electricity generated by sources such as the human body and friction between microelectronics can discharge into the product through various pathways, potentially causing damage. Therefore, attention must be paid to ESD protection, and reasonable precautionary measures should be taken. For example: Wear anti-static gloves during R&D, production, assembly, and testing processes; during product design, add ESD protection components at circuit interfaces and other points vulnerable to electrostatic discharge.

**ESD** withstand voltage (Temperature: **25~30 ℃**, Humidity: **40 ±5 %**; Unit: **kV**).

| **Test point** | **Contact discharge** | **Air discharge** |
| --- | --- | --- |
| **VBUS** and **GND** | ±5 | ±10 |
| Other interfaces | ±0.5 | ±1 |

## Operating and storage temperature

Operating and storage temperature (Unit: ℃)

| **Parameter** | **Minimum** | **Typical** | **Maximum** |
| --- | --- | --- | --- |
| Normal operating temperature | -20 | 25 | 70 |
| Storage temperature | -40 | - | 85 |